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Signed-off-by: Pavel Pisa <pisa@cmp.felk.cvut.cz>
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boot loader.
The default tms570ls3137_hdk variant is for building RTEMS
application image starting directly from start of Flash.
Variant tms570ls3137_hdk_with_loader skips 256kB at start
of Flash to allow use with application loader.
Signed-off-by: Pavel Pisa <pisa@cmp.felk.cvut.cz>
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BSP completes build with tests and debug enabled for all three variants now
tms570ls3137_hdk
tms570ls3137_hdk_intram
tms570ls3137_hdk_sdram
Even that all enabled tests builds for internal RAM variant, many
of them are expected to fail on hardware because whole tests
including code, data and runtime work area demands has to fit
into 256 kB of RAM.
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requirements.
This patch enables to build all RTEMS tests for tms570ls3137_hdk_sdram
BSP variant in in default build. Debug build with --enable-rtems-debug set
has succeed for samples subset of tests as well.
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Included variants:
tms570ls3137_hdk_intram - place code and data into internal SRAM
tms570ls3137_hdk_sdram - place code into external SDRAM and data to SRAM
tms570ls3137_hdk - variant prepared for stand-alone RTEMS aplication
stored and running directly from flash. Not working yet.
Chip initialization code not included in BSP.
External startup generated by TI's HalCoGen was used for
testing and debugging.
More information about TMS570 BSP can be found at
http://www.rtems.org/wiki/index.php/Tms570
Patch version 2
- most of the formatting suggestion applied.
- BSP converted to use clock shell
- console driver "set attributes" tested. Baudrate change working
Patch version 3
- more formatting changes.
- removed leftover defines and test functions
Todo:
refactor header files (name register fields)
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